Russia to Develop Automated Chemical Processing System for Silicon Wafers
The equipment is intended for manufacturing semiconductors and microchips.
Russia's Ministry of Industry and Trade will allocate 1.43 billion rubles (about $19 million) to develop an automated wet chemical processing system for silicon wafers up to 200 mm in diameter. The equipment is intended for semiconductor and microchip manufacturing.
The ministry's technical requirements are outlined in a public procurement tender. The system must perform silicon wafer etching, cleaning, and drying for 100 mm, 150 mm, and 200 mm wafers. It must also be capable of processing at least 100 wafers per production cycle.
The specifications also require the equipment to support at least eight different chemical reagents as well as deionized water. Reagent selection must be performed automatically.
The tender further specifies that the system must be developed using an entirely Russian component base. Imported components may be used only with the customer's explicit approval.
The contractor selection auction has already been completed, although the identity of the winning bidder has not been disclosed.
